Diallyl bisphenol A

Name: Diallyl bisphenol A (DABPA) CAS NO:1745-89-7 Molecular formula: C21H24O2 Molecular weight: 308.41 Structural formula: short

Products Details

Quality index: Appearance:Amber viscous liquid Content: ≥ 98% Boiling point: 445.2 ± 40.0 °C (predicted) Density: 1.08 g / ml at 25 °C (lit.) Refractive index n 20 / D 1.587 (lit.) Flash point > 230 °f Instruction: It is mainly used for the modification of bismaleimide resin (BMI), which can greatly reduce the application cost of BMI resin and improve the operability and processability of BMI resin. The toughness, heat resistance and molding property of BMI resin were improved. Can be used for: ① electrical insulation materials, copper-clad circuit boards, high temperature impregnating paint, insulating paint laminates, molding plastics, etc. ② Wear resistant materials, diamond grinding wheel, heavy load grinding wheel, brake pad, high temperature bearing adhesive, etc. ③ Aerospace structural materials. ④ Functional materials. As an antioxidant for rubber, adding 1-3% BBA into rubber can greatly improve the aging resistance of rubber Curing kinetics and mechanical properties of diallyl bisphenol a modified cyanate ester resin were studied: Diallyl bisphenol A (DBA) was used to modify cyanate ester resin (CE). The curing kinetic parameters of the modified resin system were calculated by Flynn wall Ozawa conversion method and Kissinger extremum method, respectively. The mechanical properties and dynamic mechanical properties of the cured resin were studied. The results showed that DBA had obvious catalytic effect and toughening effect on cyanate ester resin, The activation energy of curing reaction of modified resin containing 5% DBA was the smallest (62.16 kJ / mol). When the content of DBA was 10%, the impact strength of cured resin was 2.07 times of that of pure cyanate ester resin. The storage modulus and glass transition temperature of CE resin containing DBA decreased Diallyl bisphenol A (dabpa) was used to modify the bismaleimide resin with ether ketone structure (ek-bmi). The curing kinetics of ek-bmi / dabpa system was studied by dynamic differential scanning calorimetry, Fourier transform infrared spectroscopy, Kissinger crane method and temperature heating rate extrapolation method, The mechanical properties, fracture toughness and thermal stability of ek-bmi / dabpa system were studied. The results showed that the curing process parameters of ek-bmi / dabpa system were 165 ℃× 2 H + 180 ℃× 2 H + 238 ℃× 4 h, the post-treatment conditions were 250 ℃× 5 h, the apparent activation energy was 97.50 kJ / mol, the frequency factor was 2.22 × 107 s-1, and the reaction order was 0.9328, The tensile strength and bending strength are 89.42 MPa and 152 MPa, respectively, and the glass transition temperature is 278 ℃. It can still maintain good mechanical properties at 260 ℃. The critical stress intensity factor and critical strain energy release rate can reach 1.14 MPa · m0.5 and 276.6 J / m2, respectively, showing good fracture toughness, The initial decomposition temperature of the system is 412.95 ℃ (T5%), the mass retention rate is 37.91% at 600 ℃ and 32.17% at 900 ℃ Packing: 200kg / drum. Storage precautions: store in cool, dry and well ventilated warehouse. Annual capacity: 1000 tons / year

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